Pulse electroplating has three key adjustable deposition parameters, frequency f, duty cycle R, and average current density Jm. Pulse electroplating is the process of changing the deposition process by adjusting the waveform and these deposition parameters, thereby improving the quality of the coating. To find the optimal pulse deposition conditions for electroplating actinide elements, it is necessary to study the effects of the three key adjustable parameters on pulse electrodeposition in pulse electroplating.

In a single pulse deposition process, the pulse frequency f, duty cycle R, and current density are all pre-set and work simultaneously during the deposition process. This requires finding the optimal combination of three variable parameters to improve deposition efficiency and layer quality.

To study the effects of these variable parameters, orthogonal experimental method was introduced. Firstly, the influence weights of each parameter are determined through orthogonal experimental method, and the optimization parameters are preliminarily determined. Then, only one of the parameters is changed, and the influence of each parameter is studied one by one.

In this work, frequency f, duty cycle R, and current density Jm were selected as the influencing factors in the orthogonal method. In addition, the sedimentary medium was also included as an influencing factor. A total of four factors were examined, with three levels selected for each factor. f. The range of Jm and sedimentary medium is basically the same, while the range of R is 2.8. From this, it can be seen that the factors that have a significant impact on sedimentation rate are f, Jm, and sedimentary media, while the impact of R is minimal. R varies within the range of 10% to 30%, with little change in the horizontal mean; When Jm is at a higher current intensity of 20mA, the deposition rate is the highest, which is consistent with the empirical values obtained in our early experiments. Beyond this current value, the quality of the coating deteriorates; Below this current value, the deposition rate decreases. The deposition medium isopropanol is slightly better than DMF, but it was found in the experiment that the firmness of DMF coating is better than isopropanol. Finally, the optimized sedimentation conditions were preliminarily screened as follows: f=800Hz, R=20% or 30%, Jm=20mA, and DMF was selected as the sedimentation medium.